Key Architecture Highlights
- Memory: Memory - memory technology: Single-channel DDR5 5200 MHz Memory - memory capacity Up to 32 GB Memory - memory slots :1 x 262-pin SO-DIMM
- Show Output: Graphic - controller: Intel® UHD Graphics Graphic memory: Depends on CPU Graphic - Multi-screen support: 4 independent displays Graphic - display interfaces: HDMI 2.0 up to 4096 x 2340 @60Hz
- Wireless Network: 4 x Intel® I226-LM 2.5 GbE LAN; 4 x Intel® I226-IT 2.5 GbE LAN
Applications
- The Edge of AI
- Local AI development
- Industrial intelligence
Engineering Parameters
| Processor And Calculator | Processor: Intel® Mobile 13th Gen Raptor Lake-P U Series Processors, CoreTM i3-1315UE/i5-1335UE/i5-1345UE System Processor - processor: Intel® Mobile 13th Gen Raptor Lake-P U Series Processors, CoreTM i5-1345URE / i3-1315URE System Processor - processor frequency :3.30 GHz to 4.6 GHz (Depends on CPU) System Processor - L2 cache :6M to 12M (Depends on CPU) System Processor - processor type: BGA |
|---|---|
| Memory | Memory - memory technology: Single-channel DDR5 5200 MHz Memory - memory capacity Up to 32 GB Memory - memory slots :1 x 262-pin SO-DIMM |
| Show Output | Graphic - controller: Intel® UHD Graphics Graphic memory: Depends on CPU Graphic - Multi-screen support: 4 independent displays Graphic - display interfaces: HDMI 2.0 up to 4096 x 2340 @60Hz |
| Wireless Network | 4 x Intel® I226-LM 2.5 GbE LAN 4 x Intel® I226-IT 2.5 GbE LAN |
| External interfaces | I/O Interface - RJ-45 interface: 4 I/O Interface - Audio interface: 1 x Mic-in 1 x Line-out I/O Interface: USB interface: 4 x USB 2.0 4 x USB 3.2 Gen 2 I/O Interface: Serial ports: 4 x COM ports COM1 ~ 4 RS-232/422/485, 0V/5V/12V |
| Expansion Interface | 1 x M.2 M key (PCIe Gen4 x4 NVMe), 2280 1 x M.2 B key (PCIe x1, USB 2.0, w/NANO SIM-Holder), 2242/3042 1 x M.2 E key (PCIe x1, USB 2.0, w/CNVi), 2230 |
| Storage | 1 x 2.5" SSD Bay |
| Power input | DC-in 12V~24V Wide-Range (OCP & OVP) Phoenix pluggable connectors with latch (V+, V-) |
| Environmental requirements | Environment - operating temperature: 0 ~ 50 °C (w/ 2.5" SATA SSD(Ta: 85°C)) 0 ~ 45 °C (w/ M.2 NVMe SSD(Ta: 85°C)) Note: Thermal w/ Airflow: 0.7m/s Environment - operating temperature:-20 ~ 70 °C (w/ M.2 NVMe SSD ((Ta: 85°C), w/ WT MEM ((Ta: 95°C)) Note: Thermal w/ Airflow: 0.7m/s Environment - operating humidity: 10 ~ 90%, non-condensing Environment - storage humidity:10 ~ 90%, non-condensing Environment - storage temperature:-20 ~ 80°C |
| Dimensions And Install | Physical Characteristics - device dimensions :215 x 155 x 65 mm Physical Characteristics - weight :2.25 kg Physical Characteristics - installation method: Wall mount (STD) / DIN-rail mount(STD) / VESA mount ((by BOM option)) |
Warranty
Public manufacturer information does not specify the warranty term applicable to our supply channel. The supply region, channel and actual warranty service are confirmed in the supply contract.
Manufacturer information
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