Key Architecture Highlights
- Chassis form factor: 4U rack server
- Supported processors: Supports four 4th Intel® Xeon® Scalable processors, with up to 60 cores and 120 threads per CPU, up to 350W TDP, and 3 UPI links per CPU at up to 16GT/s per link
- Memory support: 64 DDR5 DIMMs (4,800MT/s at 1 DPC, 4,400MT/s at 2 DPC, RDIMMs/3DS-RDIMMs)
Applications
- Enterprise computing
- Virtualization and cloud computing
- Data center
Engineering Parameters
| Chassis form factor | 4U rack server |
|---|---|
| Supported processors | Supports four 4th Intel® Xeon® Scalable processors, with up to 60 cores and 120 threads per CPU, up to 350W TDP, and 3 UPI links per CPU at up to 16GT/s per link |
| Memory support | 64 DDR5 DIMMs (4,800MT/s at 1 DPC, 4,400MT/s at 2 DPC, RDIMMs/3DS-RDIMMs) |
| Drive bays | Front: 24 × 2.5-inch SAS/SATA/NVMe drives; 25 × 2.5-inch SAS/SATA drives or 21 x 2.5-inch SAS/SATA drives + 4 × 2.5-inch SAS/SATA/NVMe drives, with 8 directly-connected SATA drives onboard; 12 × 3.5-inch SAS/SATA drives + 8 × 2.5-inch SAS/SATA/NVMe drives, with NVMe RAID key supported Internal: 2 × M.2 SSD (2280/22110), with software and hardware RAID supported 3 × TF card |
| PCIe Expansion | Supports 4 full-height PCIe x16 expansion slots onboard, and 12 PCIe x8 expansion slots or 4 PCIe x16 and 4 PCIe x8 expansion slots through riser cards; supports up to 4 dual-slot GPUs or 8 single-slot GPUs |
| Networking and interfaces | Network interfaces: Supports 2 hot-swap OCP 3.0 slots with NC-SI function; supports 1 multi-host OCP 3.0 card; the OCP 3.0 cards can connect to 4 CPUs at the same time, improving the performance by 20% external interfaces: Front: 1 × USB 3.0 port, 1 × USB 2.0 port, 1 × VGA port Internal: 1 × USB 2.0 port Rear: 2 × USB 3.0 port, 1 × VGA port, 1 × management network port, 1 × BMC diagnosis serial port, 1 × system serial port |
| Cooling fans | 6 hot-swap fan modules with N+1 redundancy |
| Power supply specifications | Supports N+M(M≤N)redundant 80 Plus Platinum/Titanium CRPS PSUs with the output power of 800W/1,300W/1,600W/2,000W/2700W (options: -48 Vdc, 220 Vac /240 Vdc, and 220 Vac/240 Vdc/336 Vdc) |
| Management And Clear. | Supports AST2600 BMC chip; IPMI; Redfish; TPM 2.0/TCM; Intel platform firmware recovery function (PFR); Intel SGX; Smart PPR and Intel MFP for memory failure alarm and recovery; BMC/BIOS dual-chip redundancy; |
| Supported operating systems | Microsoft Windows Server, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, CentOS, VMware ESXi, etc. |
| Chassis dimensions (W × H × D) |
Warranty
Public manufacturer information does not specify the warranty term applicable to our supply channel. The supply region, channel and actual warranty service are confirmed in the supply contract.
Manufacturer information
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