Key Architecture Highlights
- Device dimensions: Size: 2U, 438.5 x 630 x 87.3 mm (W x D x H), 17.26 x 24.80 x 3.43 inches (W x D x H)
- Power input: Power supply: 100-240 VAC 50/60 Hz
- Maximum Power consumption: Max. utilized: 2848W
Applications
- Data center network
- AI and storage
Engineering Parameters
| Device dimensions | Size: 2U, 438.5 x 630 x 87.3 mm (W x D x H), 17.26 x 24.80 x 3.43 inches (W x D x H) |
|---|---|
| Power input | Power supply: 100-240 VAC 50/60 Hz |
| Maximum Power consumption | Max. utilized: 2848W |
| Typical. Power consumption | Typ. power consumption: 1500W** |
| Operating temperature | Operating temperature: 32° to 113°F (0° to 45°C) |
| Operating humidity | Operating humidity: 8 to 90% (RH), non-condensing |
| Redundant power supply | Hot swappable redundant power (1+1 redundancy)*** Hot swappable redundant fans (3+1 |
| Fan redundancy | Hot swappable redundant fans (3+1 redundant fan module). Each fan module with one dual-stacked fan. |
| Switching capacity (Half-difference.) | Switch fabric capacity: 51.2Tbps (half duplex) Forwarding capacity: 20.3Bpps |
| Packet forwarding rate | Forwarding capacity: 20.3Bpps |
| Forwarding latency | Latency: sub-700ns |
| Packet buffer | Packet buffer memory: 165.2MB: 82.6MB per Ingress Traffic Manager (ITM) (there are 2 per |
| Processor | CPU: Intel® Xeon® D-1714 4 core @ 2.3GHz (up to 3.4GHz in Turbo mode) CPU |
Warranty
Public manufacturer information does not specify the warranty term applicable to our supply channel. The supply region, channel and actual warranty service are confirmed in the supply contract.
Manufacturer information
Manufacturer informationVerified Documentation & Datasheets
Manufacturer product information
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