
Key Architecture Highlights
- Supported processors: Up to two 3rd Generation Intel Xeon Scalable processors, with up to 40 cores per processor
- Power supply specifications: • 800 W Platinum AC/240 Mixed Mode • 1100 W Titanium AC/240 Mixed Mode • 1400 W Platinum AC/240 Mixed Mode • 1100 W DC -48 -60 V
- Cooling fans: • Standard fan/High performance SLVR fan/High performance GOLD fan • Up to four sets (dual fan module) hot plug fans
Applications
- Corporate server computing
- Virtualization and cloud computing
Engineering Parameters
| Supported processors | Up to two 3rd Generation Intel Xeon Scalable processors, with up to 40 cores per processor |
|---|---|
| Memory support | • 32 DDR4 DIMM slots, supports RDIMM 2 TB max or LRDIMM 8 TB max, speeds up to 3200 MT/s • Up to 16 Intel Persistent Memory 200 series (BPS) slots, 12 TB max • Supports registered ECC DDR4 DIMMs only |
| Storage controller | • Internal controllers: PERC H745, HBA355I, S150, H355, H345, H755, H755N • Boot Optimized Storage Subsystem (BOSS-S1): HW RAID 2 x M.2 SSDs 240 GB or 480 GB • Boot Optimized Storage Subsystem (BOSS-S2): HW RAID 2 x M.2 SSDs 240 GB or 480 GB • External PERC (RAID): PERC H840, HBA355E |
| Drive bays | Front bays: • Up to 10 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 153 TB • Up to 4 x 3.5-inch SAS/SATA (HDD/SSD) max 64 TB • Up to 8 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 122.8 TB Rear bays: • Up to 2 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 30.7 TB |
| Power supply specifications | • 800 W Platinum AC/240 Mixed Mode • 1100 W Titanium AC/240 Mixed Mode • 1400 W Platinum AC/240 Mixed Mode • 1100 W DC -48 -60 V |
| Cooling fans | • Standard fan/High performance SLVR fan/High performance GOLD fan • Up to four sets (dual fan module) hot plug fans |
| Chassis dimensions | • Height –42.8 mm (1.7 inches) • Width –482 mm (18.97 inches) • Depth –758.27 mm (29.85 inches) – without bezel 772.11 mm (30.39 inches) – with bezel |
| Chassis form factor | 1U rack server |
| System management | The following are the main features of the software: • iDRAC9 • iDRAC Service Module • iDRAC Direct • Quick Sync 2 wireless module management software: • OpenManage Enterprise • OpenManage Power Manager plugin • OpenManage SupportAssist plugin • OpenManage Update Manager plugin |
| Security features | • Cryptographically signed firmware • Secure Boot • Secure Erase • Silicon Root of Trust • System Lockdown (requires iDRAC9 Enterprise or Datacenter) • TPM 1.2/2.0 FIPS, CC-TCG certified, TCM 2.0 optional |
| Networking and interfaces | Board Network interfaces: 2 x 1 GbE LOM External interfaces: Front Ports s • 1 x Dedicated iDRAC Direct micro- USB • 1 x USB 2.0 • 1 x VGA External interfaces: Rear Ports s • 1 x USB 2.0 • 1 x Serial (optional) • 1 x USB 3.0 • 2 x RJ-45 • 1 x VGA (optional for liquid cooling configuration) External interfaces: Internal Ports s • 1 x USB 3.0 |
Warranty
Public manufacturer information does not specify the warranty term applicable to our supply channel. The supply region, channel and actual warranty service are confirmed in the supply contract.
Manufacturer information
Manufacturer informationVerified Documentation & Datasheets
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