Key Architecture Highlights
- Supported processors: Up to two 3rd Generation Intel Xeon Scalable processors, with up to 24 cores per processor
- Memory support: Memory 16 DDR4 DIMM slots, supports RDIMM max 1 TB, speeds up to 2933 MT/s
- Drive bays: Front bays: • Up to 4 x 3.5-inch SAS/SATA (HDD/SSD) max 64 TB • Up to 8 x 2.5-inch SAS/SATA (HDD/SSD) max 61.4 TB
Applications
- Corporate server computing
- Virtualization and cloud computing
Engineering Parameters
| Supported processors | Up to two 3rd Generation Intel Xeon Scalable processors, with up to 24 cores per processor |
|---|---|
| Memory support | Memory 16 DDR4 DIMM slots, supports RDIMM max 1 TB, speeds up to 2933 MT/s |
| Storage controller | • Internal controllers (RAID): PERC H345, PERC H355, HBA355i, PERC H745, PERC H755, S150 • Internal Boot: Internal Dual SD Module or Boot Optimized Storage Subsystem (BOSS-S1): HWRAID 2x M.2 SSDs or USB • External PERC (RAID): PERC H840 • External HBA (non-RAID) HBA355e |
| Drive bays | Front bays: • Up to 4 x 3.5-inch SAS/SATA (HDD/SSD) max 64 TB • Up to 8 x 2.5-inch SAS/SATA (HDD/SSD) max 61.4 TB |
| Power supply specifications | • 600W Platinum Mixed Mode (100-240Vac or 240Vdc) hot swap redundant • 800W Platinum Mixed Mode (100-240Vac or 240Vdc) hot swap redundant • 1100W -48Vdc hot swap redundant (CAUTION: only works with -48Vdc to -60Vdc power input) |
| Cooling fans | • Standard (STD) fans or High performance SLVR fans • Up to seven cold swap fans |
| Chassis dimensions | • Height –42.8 mm (1.7 inches) • Width –482 mm (18.97 inches) • Depth –734.95 mm (28.92 inches) – without bezel 748.79 mm (29.47 inches) – with bezel |
| Chassis form factor | 1U rack server |
| System management | The following are the main features of the iDRAC service module: • iDRAC 9 • iDRAC Direct • iDRAC RESTful API with Redfish • iDRAC Service Module • Quick Sync 2 wireless module |
| Security features | • Cryptographically signed firmware • Secure Boot • Secure Erase • Silicon Root of Trust • System Lockdown (requires iDRAC9 Enterprise or Datacenter) • TPM 1.2/2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ |
| Networking and interfaces | Board Network interfaces: 2 x 1 GbE LOM External interfaces: Front Ports s • 1 x Dedicated iDRAC Direct micro- USB • 1 x USB 3.0 • 1 x VGA External interfaces: Rear Ports s • 1 x USB 2.0 • 1 x Serial (optional) • 1 x iDRAC ethernet port • 1 x USB 3.0 • 2 x Ethernet • 1 x VGA External interfaces: Internal Ports s • 1 x USB 3.0 (optional) |
Warranty
Public manufacturer information does not specify the warranty term applicable to our supply channel. The supply region, channel and actual warranty service are confirmed in the supply contract.
Manufacturer information
Manufacturer informationVerified Documentation & Datasheets
Manufacturer product information
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