Key Architecture Highlights
- Product Performance: Chip Model INT8 Theory Peak / TOPS INT4 Theory Peak / TOPS INT16 Theory Peak / TOPS: Se-won. 270 (MLUv02 Architecture) 128 * 256 * 64 *
- Calculating precision Supports: Low Precision / Mixed precision: INT16, INT8, INT4, FP32, FP16
- Memory specifications: Memory capacity memory Bitwidth of memory Bandwidth: 16GB DDR4, ECC 256 bit 102GB/s
Applications
- Cloud AI reasoning
- Data center computing
Engineering Parameters
| Product Performance | Chip Model INT8 Theory Peak / TOPS INT4 Theory Peak / TOPS INT16 Theory Peak / TOPS: Se-won. 270 (MLUv02 Architecture) 128 * 256 * 64 * |
|---|---|
| Calculating precision Supports | Low Precision / Mixed precision: INT16, INT8, INT4, FP32, FP16 |
| Memory specifications | Memory capacity memory Bitwidth of memory Bandwidth: 16GB DDR4, ECC 256 bit 102GB/s |
| Interface | The PCIe interface: × 16 PCIe Gen.3 |
| Power consumption | Maximum heat design power consumption (TDP) Maximum flat panel power consumption (TBP) cooling design: 150w 160w active cooling |
| Form | Full height, full length, double slots |
| Dimensions | 267mm × 111.15mm |
| Weight | 874g |
Warranty
Public manufacturer information does not specify the warranty term applicable to our supply channel. The supply region, channel and actual warranty service are confirmed in the supply contract.
Manufacturer information
Manufacturer informationVerified Documentation & Datasheets
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